- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/24 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including solid state components for rectifying, amplifying, or switching without a potential-jump barrier or surface barrier
Patent holdings for IPC class H01L 27/24
Total number of patents in this class: 4710
10-year publication summary
456
|
477
|
489
|
454
|
548
|
672
|
499
|
371
|
252
|
41
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Micron Technology, Inc. | 24960 |
645 |
SK Hynix Inc. | 11030 |
383 |
Samsung Electronics Co., Ltd. | 131630 |
364 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
342 |
Kioxia Corporation | 9847 |
340 |
International Business Machines Corporation | 60644 |
321 |
Sandisk Technologies LLC | 5684 |
211 |
Intel Corporation | 45621 |
146 |
SanDisk 3D LLC | 299 |
86 |
GLOBALFOUNDRIES Singapore Pte. Ltd. | 734 |
68 |
Crossbar, Inc. | 217 |
64 |
Macronix International Co., Ltd. | 2562 |
63 |
Winbond Electronics Corp. | 1173 |
54 |
Ovonyx Memory Technology, LLC | 502 |
53 |
Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
48 |
Panasonic Semiconductor Solutions Co., Ltd. | 970 |
45 |
United Microelectronics Corp. | 3921 |
40 |
Sony Semiconductor Solutions Corporation | 8770 |
39 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
38 |
Monolithic 3D Inc. | 270 |
38 |
Other owners | 1322 |